Home> Tech Resources > Package Spec.   Packaging Spec. Tech Resources:  Application Notes  Tech Resources  Packaging Spec.     PhaseLink offers a wide range of advanced packaging solutions to fit any application including QFN (3x3), MSOP, SOP, SOT, and TSSOP.  Part Marking Information The order number for this device is a combination of the following:    Part Number , Package Type, Temperature, T & R Pb-free and Green View details about PhaseLink's Pb-free and green initatives. Soldering Profile    Green Packages    Non Green Packages Products | Applications | Tech Resources | Contacts | Corporate | Login | Sitemap ©1991-2013 PhaseLink Corporation - all rights reserved